The Global Radiation Hardened Electronics (RHE) market size was USD 1.48 billion in 2021 and is expected to register a revenue CAGR of 3.9% during the forecast period, according to the latest analysis by Emergen Research. Rising demand for low-cost nanosatellites and communication satellites and increasing intelligence, surveillance, and reconnaissance operations due to growing hostility among nations are factors driving market revenue growth between 2022 and 2030. Currently, increasing number of commercial space operations have led to growing demand for radiation-hardened power management systems. In addition, rapid integration of advanced technologies for electronics in spacecraft and rising usage of low-cost nanosatellites are expected to increase demand for radiation hardening electronics in space programs. According to reports, around 64 countries have already launched their nanosatellites or CubeSats and by 2019 there were around 1,186 nanosatellites launched, which have increased in number in recent times. Moreover, increasing need for nanosatellite power conditioning procedures and usage of radiation-resistant materials are key factors expected to drive market growth. Furthermore, increasing implementation of microelectronics systems and post-irradiation examination for radiation hardening of electronics are other factors driving revenue growth of the market.
Then, the report focuses on global major leading industry players with information such as company profiles, product picture and specification, capacity, production, price, cost, revenue and contact information. Upstream raw materials, equipment and downstream consumers analysis is also carried out. What's more, the Radiation Hardened Electronics industry development trends and marketing channels are analyzed.
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Key companies operating in the Radiation Hardened Electronics market include:
BAE Systems, Honeywell International Inc., Renesas Electronics Corporation, STMicroelectronics, Infineon Technologies AG, Microchip Technology Inc., IBM, Data Device Corporation, Cobham Limited, and Micropac Industries, Inc
Key market aspects studied in the report:
Market Scope: The report explains the scope of various commercial possibilities in the global Radiation Hardened Electronics market over the upcoming years. The estimated revenue build-up over the forecast years has been included in the report. The report analyzes the key market segments and sub-segments and provides deep insights into the market to assist readers with the formulation of lucrative strategies for business expansion.
Key Benefits of the Report:
- Comprehensive analysis of the competitive scenario and its changing dynamics
- Analytical data with detailed SWOT analysis and Porter’s Five Forces analysis
- In-depth 8-year analysis of the Global Radiation Hardened Electronics Market
- Critical understanding of the key market segments
- Comprehensive analysis of the drivers, restraints, trends, and opportunities
- Detailed regional analysis and extensive company profiling
- Extensive assessment of current and emerging trends of the market
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Based on the product type, the Radiation Hardened Electronics market is segmented into:
Product Type Outlook (Revenue, USD Million; 2019–2030)
- Custom Made
- Commercial-Off-The-Shelf (COTS)
Material Type Outlook (Revenue, USD Million; 2019–2030)
- Silicon
- Silicon Carbide
- Gallium Nitride
- Others
Manufacturing Technique Outlook (Revenue, USD Million; 2019–2030)
- Radiation-Hardening-By-Design (RHBD)
- Radiation-Hardening-By-Process (RHBP)
- Radiation-Hardening-By-Software (RHBS)
Radiation Hardened Electronics Market Segmentation by Regions:
- North America (U.S., Canada)
- Europe (U.K., Italy, Germany, France, Rest of EU)
- Asia Pacific (India, Japan, China, South Korea, Australia, Rest of APAC)
- Latin America (Chile, Brazil, Argentina, Rest of Latin America)
- Middle East Africa (Saudi Arabia, U.A.E., South Africa, Rest of MEA)
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